We would like to take the opportunity to thank all our customers, prospective customers and business partners for visiting our booth at PCIM Asia held in Aug.29-31, 2023 in Shanghai, China.

The exhibition gave us the opportunity to showcase our latest product line-up,
which hopefully generated your interest.

・Solder paste with oxidation-reduction vacuum reflow process for power semiconductor device

We hope you enjoyed our booth and received the answers you were looking for.
Please do not hesitate to contact us if you have any inquiries or feedback that you would like to share.