Solder Paste
Lead Free Solder Paste for Micro-pattern Applications
- S3X811-M500-6
The integration of advanced flux technology and high-grade ultra-fine solder powder ensures superior solderability for micro components, such as 0201 - 03015 metric chip components and 0.1 mm pitch CSP).Optimized viscosity and thixotropy, along with a newly adopted solvent, enhance both continuous and intermittent printability.
feature
- Ensures excellent solderbility at fine-pitch pads
- Designed to reduce solder oxidation during preheating and enhance the meltability at fine-pitch pads.
- Reduces the occurrence of voids
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
S3X811-M500-6
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
5 - 20
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Flux Content（%）
11.4
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Viscosity（Pa.s）
200
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B)
Application of 0201/03015 Components and Future Projection
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch
To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected.
Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability.
Stable Meltability Performance Based on Flux and Activator Design
Keywords / Related Products
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