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Ultra Low Residue Wave Soldering Flux

  • JS-EU-01
Ultra Low Residue Wave Soldering Flux

The special resin formulation ensures that flux residue remains invisible after soldering, resulting in a clean, non-sticky finish. Its excellent solderability, including powerful wetting, helps prevent defects, making it suitable for a wide range of applications.

feature

  • Low solids (4.0%) powerful wetting for general applications
  • Superior solderability and through-hole holefill characteristics
  • Drastically reduces bridging, blow holes, and solder balls
  • Ultra-low residue for an excellent aesthetic appearance

Product Performance Table

  • Product name

    JS-EU-01

  • Type

    Organic acid

  • Solid Content(%)

    4.0

  • Specific gravity(at 20℃)

    0.814

  • Halide content(%)

    0

  • Flux Type

    ORL0 (IPC J-STD-004A)

  • Purpose of Use

    Wave soldering

Exceptionally Clean Appearance

JU-EU-01 contains a special resin so that its flux residue does not stand out with a clean appearance and less stickiness.

Good Soldering Finish

Temperature dependency, which has been a setback for organic acid-based flux, has been solved by improving the heat resistance.

Flux activation can be maintained through the long and high temperature soldering condition which allows for less bridging and solder ball reduction.

Improved Through-Hole Fill Performance

Flux activation during preheat and soldering has been optimized.

Through-hole fill performance, the essential quality for a wave soldering process has been improved.

One Product for Appearance, Solderability and Reliability

JS-EU-01 is designed with not only low-residue and good solderability but good electrical reliability in mind.

JS-EU-01 did not show any evidence of migration in the migration test and had sufficient insulation resistance.

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