Solder Paste
Mycronic-approved Solder Paste for Jet Dispensing
- S3X70-E160DN
S3X70-E160DN is designed for non-contact jet dispensing with clearance. This product model is certified by Mycronic for compatibility with the MY600 and MY701 jet dispensers.
feature
- Mycronic-approved product
- High-speed non-contact dispensing shortens production time
- Effective for irregularly shaped components and 3D mounting, It also enables stencil-less soldering
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
-
Product name
S3X70-E160DN
-
Composition
Sn 3.0Ag 0.5Cu
-
Melting Point（℃）
217 - 219
-
Particle Size（μm）
10 - 25
-
Flux Content（%）
15.0
-
Viscosity（Pa.s）
80
-
Halide content（%）
0
-
Flux Type
ROL0 (IPC J-STD-004A)
Solder paste approved by Mycronic
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
For more information, please contact Koki or our distributor near you.
Excellent high speed jet dispensing performance
Thanks to the optimized size of solder powder and viscosity, and adjustment in thixotropy, S3X70-E160DN wipes out concerns with conventional jet dispensing solder paste such as clogging of needles.
Further, it prevents solder icicle and spattering even in high-speed jet dispensing.
Halogen free according to BS EN 14582
S3X58-E160DN is categorized as halogen free according to BS EN 14582 (Cl + Br < 1500 ppm).
Contact Us Inquiry
Requests for estimates, requests for materials/catalogs, consultations on new installations, etc.
Please feel free to contact us.