Solder Paste
Halogen-free Solder Paste for Laser Soldering
- S3X58-M330D
The product design incorporates a highly heat-resistant thixotropic agent, preventing heat slump during laser heating and suppressing the formation of solder balls. Additionally, the high instantaneous activator enhances solder wetting on the pad, resulting in high-quality solder joints.
feature
- Non-contact heating reduces heat load on electronic components
- Suppresses flux splattering and the formation of solder balls during laser irradiation
- Consistent and stable dispensability
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
S3X58-M330D
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
13.4
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Viscosity（Pa.s）
100
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B)
Increasing Demand for Laser Soldering
Demand for laser soldering is increasing especially for consumer product market in camera modules and connector pins. Since the laser soldering can be completed without the laser actually touching component, it can not only avoid heavy thermal stresses but also the temperature variance.
Inhibits Flux Spattering and Solder Balls
A heat resistant thixotropic agent is adopted to prevent heat slump that causes solder balling.
In addition, activator with quick activation promotes superior solder wetting and forms high quality solder joints.
Maintains Insulation Resistance Over 109Ω
In general, laser soldering is associated with loss of insulation resistance as instantaneous heating may cause the solvent inside the flux to remain active even after soldering. S3X58-M330D displayed no evidence of dendritic growth or ionic migration occurrence after insulation resistance test under bias voltage (85˚C/85%RH, 1000 hrs, bias voltage 50V).
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.