Solder Paste
Super Low Cost High Reliability Solder Paste (0.1Ag)
- S01XBIG58-HF1100-3
The BIG series is a high reliability alloy with improved thermo-mechanical stress durability using unique alloy strengthening technologies, while realizing a reduced lower silver content (0.1% Ag), offering low material costs. Its thermal cycle resistance and joint strength exceed SAC305. Newly developed Flux technologies "Active Flux Coagulation" & "Activation Stabilization" achieve high levels of key soldering performance in ONE formulation!
feature
- Thermal cycle resistance and joint strength exceed SAC305, despite reduced silver content.
- Multiple features including, anti-flux splattering, ultra low voiding, powerful wetting, etc.
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S01XBIG58-HF1100-3
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Composition
Sn 0.1Ag 0.7Cu 1.6Bi +Ni
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Melting Point（℃）
211 - 227
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.7
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B/004C)
2 Approaches to Achieve Superior Durability
[Precipitation strengthening: Nickel (Ni)]
Fine intermetallic compound with high melting point is precipitated in the Sn crystal lattice to prevent dislocations from propagating beyond the grain boundaries.
[Solid solution strengthening: Bismuth (Bi)]
Atomic level strengthening by scattering of elements which have significantly larger atomic diameter in the Sn phase to generate strains in the crystalline lattice to prevent dislocation propagation.
Maintains Equivalent Joint Strength as SAC305
Strengthening element prevents changes in the solder joint structure and IMC growth during thermal cycling. Compared to SAC305, S01XBIG shows less loss of strength from thermal cycling and maintains high solder joint reliability.
S01XBIG and SAC305: Difference is “low-cost” and “high reliability”
By adding small amounts of Bi and Ni; two additive elements that have different effects, S01XBIG offers better joint strength than SAC305 and lower cost.
By changing to S01XBIG, manufacturers can benefit from less solder paste cost fluctuations owing to the rising Ag price in the industry.
Solder alloy can be selected according to the product specification
2 kinds of solder alloys are available in KOKI’s low-cost and high durability solder alloy line-up.
– S01XBIG (Sn 0.1Ag 0.7Cu 1.6Bi ＋ Ni)
– S1XBIG (Sn 1.1Ag 0.7Cu 1.8Bi ＋ Ni)
The major difference is the amount of contained Ag. This difference causes different properties and material cost.
Selecting a multi-functioning flux
The performance required in a soldering material for surface mount assembled products has become higher in terms of quality and function. The flux in S01XBIG58-HF1100-3 is unique with KOKI selecting a flux which fulfills versatile requirements using a newly introduced core technology.
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