Tack Flux
Halogen-free Tack Flux for PoP application / 3D assembly
- TF-MP2
TF-MP2 is used for transfer applications, ensuring high PoP mounting quality by stabilizing the solder paste transfer amount and addressing a key challenge in PoP applications. Additionally, it maintains the deposit shape for an extended period by optimizing the thixotropic agent.
feature
- Maintains high transfer rates even with continuous use
- Ensures stable transfer and rolling properties
- Minimizes oxidation of BGA balls and prevents the formation of head-in-pillow defects
- Achieves high reliability after soldering
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
TF-MP2
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Method of Application
Transfer
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State / Color
Amber color
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Viscosity（Pa.s）
10
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
Long-lasting transfer quality
Refining thixotropic agents allowed TF-MP2 to maintain the transferred shapes intact for a long period of time. Consistent transfer quality and rolling quality are achieved.
Swift solder spreading and assured melting
Wetting speed is improved to achieve speedy spreading. TF-MP2 ensures swift melting of solders during PoP assembly.
Improved heat resistance prevents joint defects
Oxidation of BGA balls during pre-heating is minimized, and solder swiftly melts and spreads after reaching the melting point. Joint defects are prevented by letting BGA components settle down at once.
Contact Us Inquiry
Requests for estimates, requests for materials/catalogs, consultations on new installations, etc.
Please feel free to contact us.