Heat Curable SMT Adhesive
Low Curing Temperature SMT Adhesive for Dispensing
- JU-90LT-3
Low-temperature curing significantly mitigates thermal damage / oxidation to components and substrates. It also allows the curing furnace temperature to be set lower, which saves energy and reduces CO2 emissions, contributing to carbon neutrality.
feature
- Low curing temperature mitigates damage to materials.
- Contributes to carbon neutrality by conserving energy and reducing CO2 emissions
- Consistent and stable deposit shape during continuous dispensing
- Superior electrical reliability after curing
Product Performance Table
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Product name
JU-90LT-3
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Composition
Epoxy resin
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State / Color
Paste, red
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Curing condition
90ºC, >90sec.
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Viscosity（Pa.s）
65
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Shelf life (0-10℃)
6 months
Low curing temperature mitigates damage to the PCB and the components
JU-90LT-3 cures at low temperatures around 90-100℃, reducing
the level of oxidation for the components and substrate.
It enables improvement in the overall product quality and first time product quality.
Stable dispense shape and height, superior heat slump resistance
Dispense shape of JU-90LT-3 is stable during continuous dispensing.
The dispense shape and height after 10000 shots are practically the same as the initial shots.
Furthermore, the diameter of a dispensed adhesive was only approx. 4.7% larger after being cured at 90℃ for 90 sec.*
*according to our in-house test
Excellent electrical reliability after curing, suitable for fine-pitch patterns
JU-90LT-3 after curing shows good surface insulation resistance, making it suitable for use in fine-pitch patterns.
In the biased humidity test with temp. 85℃ and humidity 85%,
JU-90LT-3 indicates good insulation resistance well after 1000 hours without any trace of electrical migration.
Contact Us Inquiry
Requests for estimates, requests for materials/catalogs, consultations on new installations, etc.
Please feel free to contact us.