Heat Curable SMT Adhesive
SMT Adhesive for Dispensing, allowing Solder Paste Self-alignment
- JU-R4S
JU-R4S is designed to start curing after the completion of the reflowing solder paste, allowing for solder self-alignment and enabling both reflow soldering and adhesive curing to be performed in a single process. Additionally, it effectively prevents bottom surface components, especially large parts, from falling, misaligning, or floating during the second reflow in double-sided soldering.
feature
- Allows solder paste self-alignment at reflow
- Reflow soldering and adhesive curing can be performed in a single operation
- Preventscomponents from falling, misaligning, or floating at the 2nd reflow in double-sided soldering
- Superior electrical reliability after curing
Product Performance Table
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Product name
JU-R4S
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Composition
Epoxy resin
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State / Color
Paste, red
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Curing condition
>220℃,>30sec.
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Viscosity（Pa.s）
50
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Shelf life (0-10℃)
6 months
Helps keep components on the board from falling, shifting, or floating during reflow
Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.
Allows solder paste self-alignment at reflow
JU-R4S is designed to commence curing after the solder
(SAC305) has melted. Therefore, JU-R4S does not hinder
self-alignment of components that may occur when the
solder has melted.
Stable dispense shape and superior electrical reliability after curing
Dispensability of JU-R4S was improved by reducing the viscosity
while shape retention was also improved by optimizing the TI value.
The resultant tall deposits ensure contact and adhesion even for tall components.
Nozzle: 19G single Dispense pressure: 350kPa Dispense time: 60msec
Clearance height: 280um Syringe temp.: 33℃
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