for Power Semiconductor Devices
The ‘Zero Flux Residue’ Solder Paste for Oxidation-Reduction Vacuum Reflow Process
- E14 series
The E14 series introduces new joining technology with the first-ever 'Zero Flux Residue' solution for power semiconductor production! Since no flux residue remains after reflow, the cleaning process can be eliminated, avoiding interference with subsequent processes such as wire bonding and molding. This allows for the replacement of solder preforms and solder pastes used in power device applications, such as IGBTs and MOSFETs, which typically require cleaning after reflow.
feature
- Suitable for power device joining, including IGBTs and power MOSFETs
- Ensures quality of soldering and ultra low voiding
- Significantly streamlines production process by eliminating the need for cleaning
- Available in various alloys (SAC305, Sn3.5Ag, Sn5Sb) and solder powders (IPC type3, 4, 6) for versatile applications
- Both printing and dispensing types are available
Product Performance Table
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Product name
E14 series
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Composition
Sn 3.0Ag 0.5Cu / Sn 3.5Ag /Sn 5Sb
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Melting Point（℃）
217 - 219 / 221 / 238 - 241
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Halide content（%）
0
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Flux Type
ORL0
Power Electronics: A Pivotal Technology for Decarbonization
Power electronics, known for its efficient power conversion with minimal energy loss, has become a focal point in the drive towards decarbonization.
These devices often incorporate multiple solder joints, varying by structure and design,
necessitating solder materials with superior joint properties to ensure high quality and reliability.
Rosin/Resin Free Technology
The E14 series paste is designed and developed in such a way that all the constituents of the flux system can be evaporated During the reflow process.
This new flux formulation forms residue free joints which is extremely important for successful molding and wire bonding.
Unparalleled Low Voiding Performance
Solder joints in power devices require minimal voiding to ensure effective heat dissipation.
E14 solder paste ensures that the flux volatilizes during the reflow process,
eliminating voids caused by residual flux regardless the type of solder alloy.
Streamline Your Production Process
E14 series are capable of eliminating the cleaning process required for a conventional rosing-based solder paste,
and the process steps such as placement of preform, attachment / detachment of fixture for solder preforms.
Cutting Half the Material Cost of Solder Preform
E14 series may reduce the material cost from preform by 50%.
Also, E14 series do not require a mold. It enables to cope with changes of product design
without high initial cost of making a new mold.
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