Solder Paste
Crack–free Flux residue Solder Paste
- GSP
GSP(Global Solder Paste) is developed in collaboration with TOYOTA Motor Corporation and recommended for automotive electronics to be used in a N₂ environment. Anti-crack resin is incorporated to prevent the cracking of flux residues. The flux residue has a moisture-proofing effect and can be expected to reduce the need for a coating process.
feature
- TOYOTA’s recommended solder paste
- Crack-free Flux residue technology for reliable automotive-applications
- Provides high insulation in a condensing environment
- May eliminate the need for cleaning or coating process
Product Performance Table
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Product name
GSP
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
10.9 / 13.0(for Dispense)
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Viscosity（Pa.s）
160 / 100(for Dispense)
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Halide content（%）
0.06
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Flux Type
ROM1 (IPC J-STD-004)
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Characteristics
for Dispense : GSP-D
No residue washing or coating required
GSP’s crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.
■Flux residue after thermal cycling
Wets lead ends
GSP exerts excellent wettability even to lead ends which are generally not plated and considered poorly wettable and contributes to improving the first time quality.
Reliable insulation in condensing environments
GSP maintains excellent insulation reliability in condensing tests conducted after thermal cycling tests (-40/+125ºC x 1000cycles). GSP’s crack-free flux residue prevents moisture absorption to joints, ensuring superb electrical reliability.
Keywords / Related Products
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