Flux Cored Solder Wire
High Reliablity Flux Cored Solder Wire based on SAC+Sb+In+Co alloy
- HR6A-72M
HR6A is an original, high reliability alloy that combines ductility and strength, achieved through an optimized hybrid alloy design. Preventing joint deformation and strengthening the metallurgical structure effectively suppresses crack extension under thermal cycle conditions. It quickly removes oxide films from substrate and component electrode surfaces, ensuring a high wetting spread.
feature
- Effectively suppresses crack extension under thermal cycle conditions
- Reduces component damage caused by CTE mismatches
- Inhibits occurrence of “Lift-Off” in Pin-in-Paste process
- Easy to clean the flux residue after soldering
Product Performance Table
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Product name
HR6A-72M
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Composition
Sn 3.4Ag 0.7Cu 3.5Sb 2.9In ＋Co
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Melting Point（℃）
211-222
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Flux Content（%）
3.2
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Halide content（%）
< 0.01
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Flux Type
ROL0 (IPC J-STD-004)
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Diameter(mm φ)
0.3, 0.5, 0.6, 0.8, 1.0 ,1.2
Alloy Characteristics: Combination of Ductility and Strength
High-reliability solder alloy HR6A is a new lead-free solder alloy which can increase the strength compared with conventional SAC305 (Sn/3.0Ag/0.5Cu) without losing ductility by inhibiting the strain build up in the solder joint.
Prevents damage from thermal-cycling
HR6A has improved thermal-fatigue resistance by adding 2 additive elements for different effects.
The first element is for solid solution strengthening which prevents deformation in the solder joint.
The second element is for precipitation strengthening which strengthens the crystal lattice with fine particles.
Superior Creep Resistance
HR6A not only displays high thermal-cycle resistance but also high creep resistance.
This characteristics improves product life by ensuring higher reliability for both surface mount components and through hole solder joints
Prevents Pad Lift-Off at Through-Hole Solder Joints
Pad lift-off is a separation of the solder fillet from the PCB side solder interface during cooling induced by a concentration of a low-melting point element (e.g. Bismuth (Bi)) in a layer at the solder joint interface. This phenomena is known to happen with a solder alloy composition which comprises of low-melting point elements.
HR6A helps prevent the lift-off occurrence by containing Indium (In) which is less likely to form a concentrated layer at the solder joint interface compared with Bi.
Superior Solder Cut and Solderability
HR6A-72M prevents insufficient solder fill and bridging at a faster process speed due to good flux performance.
It can also prevent cracked flux residue.
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