Solder Paste
Halogen-free High Reliability Solder Paste based on SAC+Sb+In+Co alloy
- HR6A58-G370N
HR6A is an original, high reliability alloy that combines ductility and strength, achieved through an optimized hybrid alloy design. Preventing joint deformation and strengthening the metallurgical structure effectively suppresses crack extension under thermal cycle conditions.
feature
- Effectively suppresses crack extension under thermal cycle conditions
- Reduces component damage caused by CTE mismatches
- Inhibits occurrence of “Lift-Off” in Pin-in-Paste process
- Designed for N2 reflow
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
HR6A58-G370N
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Composition
Sn 3.4Ag 0.7Cu 3.5Sb 2.9In ＋Co
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Melting Point（℃）
211 - 222
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Particle Size（μm）
20 - 38
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Flux Content（%）
10.6
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Viscosity（Pa.s）
200
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Halide content（%）
0
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Flux Type
ROL1 (IPC J-STD-004B)
Alloy Composition for both Ductility and Strength
High reliability solder alloy HR6A is a new solder alloy with higher reliability by reducing strain build up in the solder joint without compromising the ductility of SAC305 (Sn/3.0Ag/ 0.5Cu).
Prevents Damage from Thermal-Cycling
HR6A’s thermal fatigue resistance is improved by additive elements with 2 different functions.
Solid solution strengthening elements prevent the deformation of the solder joints and precipitation strengthening elements strengthen the bulk solder with fine precipitates.
HR6A can effectively prevent crack propagation during thermal cycling.
Lift-Off Prevention at Through-Hole Solder Joints
Lift-off is a solder joint failure seen in through-hole solder joints. The solder fillet and PCB pad is separated during cooling due to a dense low-melting point element (e.g. Bi) concentration layer at the solder joint interface. This phenomena is frequently seen in solder alloys which contain low-melting point elements.
HR6A58-G370N can prevent lift-off occurrence by containing Indium which is less likely to concentrate at the joint interface compared with Bi.
Mitigate Damage to the Components
Many of the high reliability solder alloys become too stiff as a result of strengthening which is a drawback. This causes the stress to be concentrated at the component electrode. As a result, component failure may be observed. HR6A has a reduction of stress at the component interface during thermal cycling which mitigates damage to the component.
High Electrical Reliability
HR6A58-G370N complies with the halogen-free standard (Br+Cl: <1500ppm, according to BS EN14582).
Insulation resistance in the migration test is consistently above 1.0×1010Ω, suggesting good electrical reliability of the flux residue. HR6A is durable and eco-friendly.
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