Heat Curable SMT Adhesive
General-Purpose SMT Adhesive for Dispensing
- JU-110-3
JU-110-3 is designed for general application use and supports micro-components such as 0402 metric (01005) chips and high-speed dispensing. It offers excellent shape retention with minimal heat slump during curing, maintaining height and a stable deposit shape throughout continuous use.
feature
- Supports micro-components such as 0402 metric (01005) chips and high-speed dispensing
- Consistent and stable deposit shape during continuous dispensing
- Superior electrical reliability after curing
Product Performance Table
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Product name
JU-110-3
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Composition
Epoxy resin
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State / Color
Paste, red
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Curing condition
130ºC, >60sec.
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Viscosity（Pa.s）
60
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Shelf life (0-10℃)
6 months
Stable and tall deposits ensure contact even with 1005 chip components
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved,
improving reliability of the wave soldering process.
Resistant to heat slump
JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.
Compliant to REACH regulation
JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.
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