Heat Curable SMT Adhesive
General-Purpose SMT Adhesive for Dispensing
- JU-110-3
JU-110-3 is designed for general application use and supports micro-components such as 0402 metric (01005) chips and high-speed dispensing. It offers excellent shape retention with minimal heat slump during curing, maintaining height and a stable deposit shape throughout continuous use.
feature
- Supports micro-components such as 0402 metric (01005) chips and high-speed dispensing
- Consistent and stable deposit shape during continuous dispensing
- Superior electrical reliability after curing
Product Performance Table
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Product name
JU-110-3
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Composition
Epoxy resin
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State / Color
Paste, red
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Curing condition
130ºC, >60sec.
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Viscosity（Pa.s）
60
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Shelf life (0-10℃)
6 months
Stable and tall deposits ensure contact even with 1005 chip components
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved,
improving reliability of the wave soldering process.
Resistant to heat slump
JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.
Compliant to REACH regulation
JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.
Contact Us Inquiry
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