Heat Curable SMT Adhesive
Low Curing Temperature SMT Adhesive for Dispensing
- JU-90LT-3
Low-temperature curing significantly mitigates thermal damage / oxidation to components and substrates. It also allows the curing furnace temperature to be set lower, which saves energy and reduces CO2 emissions, contributing to carbon neutrality.
feature
- Low curing temperature mitigates damage to materials.
- Contributes to carbon neutrality by conserving energy and reducing CO2 emissions
- Consistent and stable deposit shape during continuous dispensing
- Superior electrical reliability after curing
Product Performance Table
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Product name
JU-90LT-3
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Composition
Epoxy resin
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State / Color
Paste, red
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Curing condition
90ºC, >90sec.
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Viscosity（Pa.s）
65
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Shelf life (0-10℃)
6 months
Low curing temperature mitigates damage to the PCB and the components
JU-90LT-3 cures at low temperatures around 90-100℃, reducing
the level of oxidation for the components and substrate.
It enables improvement in the overall product quality and first time product quality.
◾️Curing Condition and Bonding Strength
Stable dispense shape and height, superior heat slump resistance
Dispense shape of JU-90LT-3 is stable during continuous dispensing.
The dispense shape and height after 10000 shots are practically the same as the initial shots.
Furthermore, the diameter of a dispensed adhesive was only approx. 4.7% larger after being cured at 90℃ for 90 sec.*
*according to our in-house test
Excellent electrical reliability after curing, suitable for fine-pitch patterns
JU-90LT-3 after curing shows good surface insulation resistance, making it suitable for use in fine-pitch patterns.
In the biased humidity test with temp. 85℃ and humidity 85%,
JU-90LT-3 indicates good insulation resistance well after 1000 hours without any trace of electrical migration.
◾️Biased Humidity Test
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.