Solder Paste
Low Cost High Reliability Solder Paste (1.1Ag)
- S1XBIG58-HF1100-3
The BIG series is a high reliability alloy with improved thermo-mechanical stress durability using unique alloy strengthening technologies, while realizing a reduced low silver content (1.1% Ag), offering lower material costs. Its thermal cycle resistance and joint strength exceed SAC305. Newly developed Flux technologies "Active Flux Coagulation" & "Activation Stabilization" achieve high levels of key soldering performance in ONE formulation!
feature
- Thermal cycle resistance and joint strength exceed SAC305, despite reduced silver content.
- Enables to use the same reflow profile as SAC305
- Multiple features including, anti-flux splattering, ultra low voiding, powerful wetting, etc.
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S1XBIG58-HF1100-3
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Composition
Sn 1.1Ag 0.7Cu 1.8Bi +Ni
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Melting Point（℃）
211 - 223
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.7
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B/004C)
2 Approaches to Achieve Superior Durability
[Precipitation strengthening: Nickel (Ni)]
Fine intermetallic compound with high melting point is precipitated in the Sn crystal lattice to prevent dislocations from propagating beyond the grain boundaries.
[Solid solution strengthening: Bismuth (Bi)]
Atomic level strengthening by scattering of elements which have significantly larger atomic diameter in the Sn phase to generate strains in the crystalline lattice to prevent dislocation propagation.
Maintains Equivalent Joint Strength as SAC305
Strengthening element prevents changes in the solder joint structure and IMC during thermal cycling. Compared to SAC305, S1XBIG shows loss of strength from thermal cycling and maintains high solder joint reliability.
S1XBIG and SAC305: Difference is “low-cost” and “high reliability”
By adding small amounts of Bi and Ni; two additive elements that have different effects, S1XBIG offers better joint strength than SAC305 and lower cost.
By changing to S1XBIG, manufacturers can benefit from less solder paste cost fluctuations owing to the rising Ag price in the industry.
S1XBIG Can Be Reflowed Using the Same Reflow Profile as SAC305
Low-Ag solder alloy has a drawback of increased melting point. However, S1XBIG prevents melting point increase so that it can be reflowed using the same reflow profile as SAC305.
Selecting a multi-functioning flux
The performance required in a soldering material for surface mount assembled products has become higher in terms of quality and function. The flux used in S1XBIG58-HF1100-3 is unique with KOKI selecting a flux which fulfills versatile requirements using a newly introduced core technology
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