Solder Paste
Crack-free Flux residue Solder Paste Applicable for Air Reflow
- S3X58-CF100-2
Anti-crack resin is incorporated to prevent the cracking of flux residues. The flux residue has a moisture-proofing effect and can be expected to reduce the need for a coating process. S3X58-CF100-2 is the first crack-free flux residue solder paste on the market supported air reflow.
feature
- Crack-free Flux residue technology for reliable automotive-applications
- Provides high insulation in a condensing environment
- Extremely low voiding at large parts
- Designed for air reflow
Product Performance Table
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Product name
S3X58-CF100-2
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
10.8
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROM1 (IPC J-STD-004B)
Suppresses ion migration
By adopting special resin into the flux, the residue remains flexible at a wider temperature range.
Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced.
No residue washing or coating required
S3X58-CF100-2 crack-free flux residue acts as a coating and prevents condensation and contamination at joints.
Therefore, residue washing or coating is not needed.
The number of processes will be reduced, and significant cost benefit can be anticipated.
Passed various insulation tests for automotives
In addition to typical test standards, various insulation tests specified by automotive component manufacturers has been carefully conducted.
Through these tests, S3X58-CF100-2 has proven that crack-free residue achieves high electrical reliability.
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