Solder Paste
Solder Paste for General Dispensing Applications
- S3X58-M406D
S3X58-M406D is designed for viscosity stability and maintains consistent deposit shape during continuous dispensing, ensuring precise application and reducing the risk of defects in high-volume production.
feature
- Excellent Dispensability
- Extremely long tack time offers wide process window
- Consistent deposit shape in long-term use
- Superior storage stability (6 months / Refrigerated)
Product Performance Table
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Product name
S3X58-M406D
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
13.0
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Viscosity（Pa.s）
140
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Halide content（%）
0
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Flux Type
ROL0（IPC J-STD-004）
Demand for Dispense Applications
In dispense applications, solder paste is filled into a syringe and fed on the PCB using a dispenser.
In surface mount technology, stencil printing of solder paste is the mainstream method in terms of applying solder paste on a PCB. However, due to new technologies, the surface mount process and product design have become so versatile that the traditional paste printing method is no longer compatible. Consequently, demand for the dispensing application method is increasing.
Benefit of the Dispense Application
The dispense application offers its own benefits that the print application cannot offer due to the different feeding method.
– Can provide solder paste after other components have been placed.
– Free from the constraints of the metal stencil, ideal for multiple model and small lot production
– Dispense volume can be adjusted easily
– Improves product design possibilities.
– Can be used for rework.
Highly Uniform and Spherical Solder Powder
Solder powder size deviation is so small that it will not clog the needle and the volume of dispensed solder paste is consistent. Stable and accurate dispense performance is ensured.
Stable Dispense Shape
By combining carefully selected solder powder and flux with little viscosity change, S3X58-M406D achieves stable dispensed shape during continuous dispensing. In addition, its flux has high heat-resistance to allow for good solder meltability.
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.