Solder Paste
ICT testable no-clean / cleanable Halogen-free Solder Paste
- S3X58-M650-7
Innovatively engineered, the low stickiness of the flux residue prevents adhesion to test pins, improving ICT first pass yield. S3X58-M650-7 also offers excellent cleanability, making it suitable for both no-clean and clean applications.
feature
- Specially designed flux for improved ICT testability
- Easy to eliminate the flux residue with cleaning materials and equipment
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S3X58-M650-7
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.5
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Viscosity（Pa.s）
200
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B)
Good inspection properties
S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
■Resistance between Probe and PCB
Superior wetting ability prevents voiding
For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S3X58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.
■X-ray image：LGA
“Halogen-free” – addressing the environment
One keyword of environmental measures is “halogen-free”; these days companies demand final products to be halogen-free. Halogen-free S3X58-M650-7 meets such demands while providing both reliability and workability.
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.