Solder Paste
Mycronic-approved Solder Paste for Jet Dispensing
- S3X70-E160DN
S3X70-E160DN is designed for non-contact jet dispensing with clearance. This product model is certified by Mycronic for compatibility with the MY600 and MY701 jet dispensers.
feature
- Mycronic-approved product
- High-speed non-contact dispensing shortens production time
- Effective for irregularly shaped components and 3D mounting, It also enables stencil-less soldering
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
S3X70-E160DN
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
10 - 25
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Flux Content（%）
15.0
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Viscosity（Pa.s）
80
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
Solder paste approved by Mycronic
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
For more information, please contact Koki or our distributor near you.
■Mycronic MY700
Excellent high speed jet dispensing performance
Thanks to the optimized size of solder powder and viscosity, and adjustment in thixotropy, S3X70-E160DN wipes out concerns with conventional jet dispensing solder paste such as clogging of needles.
Further, it prevents solder icicle and spattering even in high-speed jet dispensing.
Halogen free according to BS EN 14582
S3X58-E160DN is categorized as halogen free according to BS EN 14582 (Cl + Br < 1500 ppm).
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.