Solder Paste
Multi-feature Halogen-free Solder Paste for fine-pitch printing
- S3X70-HF1100-3
Newly developed Flux technologies "Active Flux Coagulation" & "Activation Stabilization" achieve high levels of key soldering performance in ONE formulation! S3X70-HF1100-3 realizes superior solderability for micro components, such as 0402 metric chips and 0.4 mm pitch BGAs
feature
- Multiple features including, anti-flux splattering, ultra low voiding, powerful wetting, etc.
- Realizes excellent solderability for micro components
- Exhibits superior print quality response with >1hour stencil idle time
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S3X70-HF1100-3
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
10 - 25
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Flux Content（%）
12.0
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B/004C)
Solves Various Surface Mounting Issues
The performance required in a soldering material for surface mount assembled products has become higher in terms of quality and function. The flux used in S3X70-HF1100-3 is unique with KOKI selecting a flux which fulfills versatile requirements using a newly introduced core technology
2 Innovative and New Technologies
KOKI developed 2 new flux technologies to improve product performance.
These technologies enable a unique solder paste with multiple outstanding characteristics.
Good Solderability at 0402 Metric (01005 Imperial) Size
Chip Component
S3X70-HF1100-3 is compatible with micro-component soldering so that it can maintain a high solder paste transfer ratio throughout continuous printing processes at fine pitch pads. In addition, it has good wettability with no unmolten solder after reflow.
Powerful Wettability
In general, high wettability and stability during room temperature storage does not coincide. However, HF1100-3 was able to satisfy both characteristics. By combining the activators effectively for good wettability, the oxide layer can be removed efficiently without losing viscosity stability.
HF1100-3 ensures good wetting performance on hard-to wet substrates.
Significant Void Reduction
Not only the solder powder but also the flux coagulates during the reflow. Coagulated flux absorbs gas generated in the molten solder and exits the molten solder. As a result, the flux trapped in the solder which may become void is reduced.
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