Solder Paste
Solder Paste for Micro Pattern Dispensing Applications
- S3X70-M500D
S3X70-M500D delivers exceptional dispensing performance in fine pattern applications. It is designed for viscosity stability and maintains consistent deposit shape during continuous dispensing, ensuring precise application and reducing the risk of defects in high-volume production.
feature
- Compatible with micro-needle (0.3 mm dia.) dispensing
- Extremely long tack time offers wide process window
- Low voiding achieved through sustained activation strength
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
S3X70-M500D
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
10 - 25
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Flux Content（%）
14.0
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Viscosity（Pa.s）
100
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
Uniformly spherical solder powder
The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.
Consistent deposit shape even in long-term uses
Carefully selected solder powder and flux of highly consistent viscosity in continual use maintain fine print shapes even in long-term uses.
Superbly low voiding for any component
S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component.
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