Solder Paste
Lead Free Solder Paste for Micro-pattern Applications
- S3X811-M500-6
The integration of advanced flux technology and high-grade ultra-fine solder powder ensures superior solderability for micro components, such as 0201 - 03015 metric chip components and 0.1 mm pitch CSP).Optimized viscosity and thixotropy, along with a newly adopted solvent, enhance both continuous and intermittent printability.
feature
- Ensures excellent solderbility at fine-pitch pads
- Designed to reduce solder oxidation during preheating and enhance the meltability at fine-pitch pads.
- Reduces the occurrence of voids
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
S3X811-M500-6
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
5 - 20
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Flux Content（%）
11.4
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Viscosity（Pa.s）
200
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B)
Application of 0201/03015 Components and Future Projection
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
■Trend of Ceramic Capacitor Sizes
Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch
To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected.
Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability.
■Continuous Printability
■Intermittent Printability
Stable Meltability Performance Based on Flux and Activator Design
■Protect Solder Powder by Flux
Keywords / Related Products
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