SE58-M955LV for high-density applications, offering superior wettability

SE58-M955LV enhances continuous paste printability, ensuring stable performance and optimal meltability for fine patterns (0.25 mmφ CSP, 0603 metric chip). It also delivers superior wettability across various component sizes and has ultra low voiding. This high-performance solder paste offers excellent workability, solderability, and residue reliability.

SS58-M955LV for minimizing voiding in bottom termination components

The newly designed flux activator ensures minimal voiding in bottom electrode components like PwTr, QFN, LGA, and BGA. Additionally, the inclusion of Ag offers a broad range of melting points and helps prevent tombstone defects.

◾️Void result of different components

SSA48-M955 for preventing tombstone defects 

Tombstoning is a defect where solder on both electrodes of a chip component does not wet and melt simultaneously, causing the component to lift due to the surface tension of the solder that wets one side first. Adding a small amount of Sb (antimony) reduces wetting tension and prevents the occurrence of tombstone defects