SE58-M955LV for high-density applications, offering superior wettability

SE58-M955LV enhances continuous printability, ensuring stable performance and optimal meltability for fine patterns (0.25 mmφ CSP, 0603 metric chip). It also delivers superior wettability across various component sizes and performs ultra low voiding. This high-performance solder paste offers excellent workability, solderability, and residue reliability.

SS58-M955LV for minimizing voiding in bottom electrode components

The newly designed activator ensures minimal voiding in bottom electrode components like PwTr, QFN, LGA, and BGA. Additionally, the inclusion of Ag offers a broad range of melting points and helps prevent tombstone defects.

SSA48-M955 for preventing tombstone defects 

Tombstone is a defect where solder on both electrodes of a chip component doesn’t wet and melt simultaneously, causing the component to lift due to the surface tension of the solder that wets one side first. Adding a small amount of Sb (antimony) reduces wetting tension and prevents the occurrence of tombstone defects