Solder Paste
High Performance Low Melting Point Solder Paste
- T4AB58-HF360
T4AB is our original low melting point alloy. Our unique flux technology delivers a well-balanced product that addresses the printability and insulation resistance issues found in conventional products. We recommend it to customers seeking cost savings, reduced environmental impact, and improved workability. It is ideal for use with heat-sensitive components (such as ICs, sensors, mini/micro LEDs, BGAs) and substrates (such as flex boards, PET FPCs, etc.)
feature
- The low-temperature profile allows the use of materials with lower heat resistance
- Contributes to carbon neutrality by conserving energy and reducing CO2 emissions
- Prevents drying for stable performance in continuous printing.
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
T4AB58-HF360
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Composition
Sn 0.4Ag 57.6Bi
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Melting Point（℃）
138 - 140
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Particle Size（μm）
20 - 38
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Flux Content（%）
10.0 / 11.8(for Dispense)
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Viscosity（Pa.s）
200 / 100(for Dispense)
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B)
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Characteristics
for Dispense : T4AB58-HF360D
Energy-saving whilst reducing thermal damage to components and board
The melting temperature of T4AB58-HF360 is 138-140ºC, lower than SAC305 making it ideal for soldering heat-sensitive components and PCBs.
As the reflow profile can be set lower, the energy consumption can be reduced by approx. 40%.
Further, the less energy consumption contributes to lower CO2 emission.
New technology keeps the solder paste from drying for stable performance in continuous use.
The viscosity stability and tack time are also improved to ensure component retention during and after the component is placed.
Good wettability and low void performance
T4AB58-HF360 effectively prevents the occurrence of voiding at the solder joint with various
types of components such as QFN/BTC, Pwtr, chip component, etc.
Low voiding is ensured even when the printed / dispensed solder paste is left on the board for
a longer period of time before component placement and reflow.
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