KOKI COMPANY LIMITED KOKI COMPANY LIMITED

  1. ホーム
  2. Technical Support

Technical Support

We are committed to providing
the best support to resolve your
soldering challenges

To ensure our customer’s satisfaction in their manufacturing processes using our product, we offer a range of support services, including various product verification tasks and analysis of issues and defects that arise in daily production. We are fully committed to providing comprehensive support, ensuring that our customers can use our products with confidence and achieve successful manufacturing outcomes.

Trust us to Address Your Concerns

  1. 01

    Only certain boards or components are experiencing de-wetting, and the root cause is still unclear

    Only certain boards or components are experiencing de-wetting, and the root cause is still unclear

  2. 02

    There is unknown foreign object debris on the parts.

    There is unknown foreign object debris on the parts.

  3. 03

    Looking to optimize printing parameters to enhance soldering quality

    Looking to optimize printing parameters to enhance soldering quality

  4. 04

    Looking to optimize the reflow profile to reduce voiding

    Looking to optimize the reflow profile to reduce voiding

What is Technical Support?

Analytical Service

Analytical Service

Our experienced engineers, specializing in joining technology, provide a technical approach with a comprehensive range of analytical, verification, and inspection equipment. We conduct analysis from physical, chemical, and electrical perspectives to identify root causes and deliver tailored solutions

Process Optimization

Process Optimization

We support the optimization of process conditions to ensure that Koki products achieve peak performance and quality. We replicate the customer's assembly environment—such as printing conditions and reflow profiles—on our test lines to tailor the process accordingly.

Key analysis and measurement items

External Observation

External Observation

  • Observes Defective Point
  • Identifies Nature of Defect
SEM/EDX Analysis

SEM/EDX Analysis

  • Evaluates Quality of Plating
  • Identifies Contaminating Element
FT-IR Analysis

FT-IR Analysis

  • Analyzes Contaminating Element
  • Identifies Contaminating Substance
Cross Section Observation

Cross Section Observation

  • Evaluates IMC (Intermetallic Compound)
  • Evaluates Crystalline Structure
  • Observes Defect (eg. Head-in-Pillow, Tombstone)
X-ray Analysis

X-ray Analysis

  • Observes Voiding
  • Observes Head -in-Pillow Defects
Simulation

Simulation

  • Simulates Wetting Behavior
  • Observe Warpage of Component and Board
  • Suggests Recommended Reflow Conditions
Joint Strength Test

Joint Strength Test

  • Evaluates Shear Strength
  • Evaluates Pull Strength
  • Observes Breakage Mode
Thermal Shock Test

Thermal Shock Test

  • Evaluates Joint Durability
  • Observes Growth of IMC
SIR Test

SIR Test

  • Observes Electro-Migration in Thermohygrostat
  • Evaluates Voltage Applied SIR
  • Evaluates Drying at Normal Temp

Service Flow

01

Contact Contact

Reach out to us via the contact button below.

02

Consulting Consulting

We will contact you for further details

03

Analysis Analysis

Our engineers conduct analysis and evaluation based on the provided conditions

04

Reporting Reporting

We will provide you with a test report of the analysis results

05

Solution Solution

Share your feedback with us to further assist in resolving challenges!

Contact Us

For any requests for estimates, product information, technical questions, etc. please reach out to us.