Challenge
Lift-off prevention
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What is a lift-off?
Lift-off is a separation between the solder and soldering pad seen mainly in through-hole soldering due to the solidifying and shrinking solder. It is also called a fillet-lifting. There are 3 kinds of lift-offs as described below, and in most cases, it is lifted off at the solder fillet.
Type of the lift-offs
- Fillet lift-off: Solder fillet is separated from the soldering pad.
- Component lead lift-off: Component lead is separated from the solder.
- Soldering pad lift-off: Soldering pad is delaminated from the PCB
■Fillet Lift-Off
Mechanism of lift-off
Concerns regarding lift-offs
Fillet lift-off often considered as not a defect, because the separation does not significantly progress after thermal-cycling test just like a cavity void. However, it has also been reported that the bond strength was deteriorated after thermal-cycling test. Consequently, since it is a separation of a solder joint, it is desirable to be lift-off free. Lift-off occurrence is barely reported from alloy composition which does not contain low-melting point metals.
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