Solder Paste
Multi-feature Halogen-free Solder Paste for General Applications
- S3X58-HF1100-3
Newly developed Flux technologies "Active Flux Coagulation" & "Activation Stabilization" achieve high levels of key soldering performance in ONE formulation! S3X58-HF1100-3 is suitable for large industrial fields, particularly meeting most of the requirements of the automotive industry.
feature
- Multiple features including, anti-flux splattering, ultra low voiding, powerful wetting, etc.
- Exhibits excellent print quality response with >1hour stencil idle time
- 12-month shelf life under refrigerated storage
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S3X58-HF1100-3
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.7
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004B/004C)
Solves Various Surface Assembly Issues
The performance required in a soldering material for surface mount assembled products has become higher in terms of quality and function. The flux used in S3X58-HF1100-3 is unique with KOKI selecting a flux which fulfills versatile requirements using a newly introduced core technology
2 Innovative and New Technologies
KOKI developed 2 new flux technologies to improve product performance.
These technologies enable a unique solder paste with multiple outstanding characteristics.
Powerful Wettability
In general, high wettability and stability during room temperature storage does not coincide. However, HF1100-3 was able to satisfy both characteristics. By combining the activators effectively for good wettability, the oxide layer can be removed efficiently without losing viscosity stability.
HF1100-3 ensures good wetting performance on hard-to wet substrates.
Prevent Flux Splattering
Flux will pull away from the top of the molten solder so that the flux would not splatter when air bubble is expelled from the molten solder.
Significant Void Reduction
Not only the solder powder but also the flux coagulations during the reflow. Coagulated flux absorbs gas generated in the molten solder and exits the molten solder. As a result, the flux trapped in the solder which may become voids is reduced.
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