Applications
Automotive
Challenges in the Automotive industry
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Zero emissions for greenhouse gas in accordance with carbon neutrality
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Reduction of CO2 emissions
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emission control regulations
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Transition from Internal Combustion Engines to EVs
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Improvements in safety performance
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Improvement in autonomous driving technology
Growth in the Number of Mounted Boards
Due to the integration of numerous advanced technologies in future vehicles, the number and multifunctionality of automotive products as well as its substrates are expanding. Consequently, performance requirements are continually evolving, necessitating ongoing adaptations.
Performance requirements for automotive products
Unlike household appliances, many automotive products are critical to human safety and thus require a higher level of product reliability. The circuit boards that are part of automotive products are becoming increasingly diverse with different performance requirements.
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Engine compartment
The reliability requirements are highly demanding, as the boards are mounted near the engine.
In addition to the thermal cycles, high temperature and humidity, a dew condensation cycle test is now incorporated in the reliability assessment
due to the expected sudden changes from low to high temperatures under the operating environment.Required Properties
‘High Reliability’ ‘Dew Condensation Resistance’
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Passenger compartment
Reliability requirements for boards used in this area are relatively lenient. These products often exhibit component miniaturization and cost reduction requirements similar to those found in consumer electronics.
Required Properties
‘fine pitch pattern applicable’ ‘Low cost’
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Power Devices
The demand for power devices is increasing with the spread of electric vehicles.
As power devices are mounted on large pad surfaces, occurrence of voiding in solder joints are a significant issue.
The assembly method also differs from the norm of the SMT process and often uses specialized equipment such as oxidation-reduction vacuum reflow ovens.Required Properties
‘oxidation-reduction vacuum reflow compatible’ ‘ultra-low voiding’
Related Products
KOKI is continuously developing a wide range of products utilizing advanced alloy and flux technologies to provide optimal solutions for Surface Mount production in the automotive industry.
The following technologies are proposed as solutions for the automotive industry.
High Reliability
High Reliability alloy with significantly enhanced resistance to thermal cycles compared to the conventional SAC305 alloy
Clack-free flux residue
The flexibility of the flux residue helps prevent cracking due to bending in flexible substrates.
Fine-Pitch
Ensuring consistent printability and reliable solderability with fine solder particles
Low Cost
Achieving cost reductions by lowering silver content and incorporating
strengthening elements to enhance durability beyond that of SAC305 alloy
Formic acid Oxidation-Reduction Reflow
Realizing ultra-low voiding and no flux residue resulting in eliminating cleaning processes by solder paste through oxidation-reduction vacuum reflow processing
Other applications
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