Miniaturisation of mounted components

Ceramic capacitors are progressively miniaturizing, now reaching sizes as small as 0201 metric.
By improving functionality of devices hereafter, the demand for these fine components will continue to grow.

Material cost reduction

In the mobile industry, reducing　material costs is crucial due to the intense price competition.
One effective solution is to decrease the content of precious metals like silver, which significantly impacts material costs.

Securing mounting space for components

As electronic devices are becoming smaller and high-density mounting in accordance with improvement of functionality,
component stacking becomes a crucial method for limited board space.
Package stacking (PoP method) offers a higher degree of flexibility in addition to a chip component stacking.

Weight-saving

Thin and lightweight substrates like flexible and PET materials are becoming essential for product miniaturization.
Applying low-temperature soldering on PET substrates not only reduces costs but also CO2 emissions, contributing to carbon neutrality.

Complexity of component mounting points

Non-contact supply by jet dispenser

As mobile/smart devices evolve and feature increasingly complex component mounting points,3D mounting solutions are becoming more common. For these advanced designs,
where traditional printing methods are inadequate, non-contact solder paste application is essential.

Compatible with a wide range of mounting components

The functionalization of mobile devices has led to a greater variety of component types and electrode materials, including mounting both large and small components on the same substrate.
This diversity has increased the range of mounting characteristics required.