Solder Paste
Solder Paste applicable for Jet Dispensing
- E150DN series
E150DN series are designed for non-contact jet dispensing with clearance. Our technology successfully overcomes typical jet dispensing challenges, including needle clogging, stringing at high speed dispensing, and solder splatter.
feature
- High-speed non-contact dispensing shortens production time
- Effective for irregularly shaped components and 3D mounting, It also enables stencil-less soldering
- Available in various powder sizes (IPC type 4-6) for versatile applications
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
E150DN series
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
58: 20 - 38 / 70: 10 - 25 / 811: 5 - 20
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Flux Content（%）
15.0
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Viscosity（Pa.s）
40
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
Consistently Deposited Solder
Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint.
Stable Solder Paste Shape
Configuration of dispensed solder paste is stable all the way through in jet dispensing, as the process does not involve a nozzle contact which is responsible for causing bridges.
Achieves High Precision Dispensing
E150DN Series wipes out concerns with jet dispensing of solder paste such as clogging of needles, solder icicle, and spattering by optimizing size of solder powder and viscosity, and adjusting thixotropy.
Contact Us Inquiry
Requests for estimates, requests for materials/catalogs, consultations on new installations, etc.
Please feel free to contact us.