Solder Paste
Upgraded Powerful Wetting Solder Paste for general application
- S3X58-M500C-7
The unique flux technology ensures powerful wetting regardless of the component material, even on severely oxidized pads (Copper, Tin and Nickel, Palladium, etc.). S3X58-M500C-7 is designed to remove the oxide film during the preheating and forms a new protective layer on the surface of the solder particles. This effectively prevents re-oxidation during the heating zone, resulting in consistent and powerful wetting.
feature
- Powerful wetting regardless of material
- Extremely low voiding
- Inhibits the occurrence of HiP and solder beading
- Applicable to a wide range of reflow profiles due to its high heat resistance
Product Performance Table
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Product name
S3X58-M500C-7
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.8
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Viscosity（Pa.s）
200
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004)
Activator Technique
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Low Voiding Technique
Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
Test condition
・ Stencil : 200μm / 6.5mmφ aperture
・ Pre-conditioning : 150ºC for 16Hr
・ Heat source : Convection reflow
・ Reflow : Air
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.