Requirement
SMT Adhesive
Table of contents
What is self-alignment?
Self-alignment is the ability to move surface mount component to a correct position by molten solder’s surface tension during reflow.
Issue with self-alignment during reflow
In double-sided soldering, temporary SMT adhesive may be applied on the PCB soldering pads to prevent components from falling. In such case, general SMT adhesive would be cured before the solder reaches liquidus temperature, making it impossible for the molten solder to perform self-alignment ability and correct the position of misaligned component.
Keys to prevent issues
- Improve the accuracy of component mounting
- Temporary adhesive would not inhibit self-alignment feature
- Control the volume of the solder paste on the pads
Solution
By using an SMT adhesive for reflow soldering, misaligned component can be prevented from soldered in a misaligned position.
SMT adhesive for reflow soldering
Self-alignment compatible adhesives are designed not to inhibit the self-alignment ability of the solder. Unlike medium temperature cure (130~150˚C) or low temperature cure (below 100˚C) SMT adhesives, it will not cure until the solder is molten. As a result, mis-aligned component can be corrected to right position by molten solder.
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