would like to take the opportunity to thank all our customers, prospective customers and business partners for visiting our booth at 39th INTERNEPCON JAPAN held in January. 22 – 24, 2025 in Tokyo, Japan.​

The exhibition gave us the opportunity to showcase our latest product line-up, which hopefully generated your interest.​

Soldering Materials Contributing to Carbon Neutrality

​・Halogen-free High Reliability Solder Paste based on SABI alloy ​

・High Performance Low Melting Point Solder Paste​

Environmental Sustainability​

・Multi-feature Halogen-free Solder Paste for General Applications​

・Newly developed High Reliability alloy ​

Optimization​

・The ‘Zero Flux Residue’ Solder Paste for Oxidation-Reduction Vacuum Reflow Process​

・Pin-in-Paste method​

We hope you enjoyed our booth and received the answers you were looking for.​

Please do not hesitate to contact us if you have any inquiries or feedback that you would like to share.​soldering technology, energy savings, and power efficiency.

See you at the next show!​