We are pleased to announce the launch of S3X58-HF1200, a super-low void, multi-feature solder paste for SMT applications.
Our newly developed flux technology, ” Dual 2-Step Technology”, enhances both void reduction and wettability through two synergistic steps, achieving an unprecedented level of low voiding and powerful wettability.

Additionally, this multi-feature product addresses various mounting challenges, including voiding, wettability, flux spattering, printability, electrical reliability, and halogen-free requirements.
If you are facing any challenges in your SMT process, we highly recommend giving this product a try.