We are pleased to announce the release of our new high-reliability solder paste for SMT applications: SB6NX58-G850.

Formulated with a solid-solution-strengthened solder alloy, this paste suppresses microstructural transformation at the solder joints, offering excellent thermal mechanical resistance. It is well-suited for use in harsh environments and contributes to longer product life in automotive and industrial equipment.

Additionally, our advanced flux technology enables stable super low-void performance, even in the case of this high-reliability alloy, which typically results in higher void rates.

If you are currently facing challenges in your soldering process, we highly recommend giving this product a try.

For more details, please refer to the product page.

SB6NX58-G850 (Powder size: Type 4)