We are pleased to announce that KOKI will be exhibiting at “PCIM ASIA Shenzhen 2026”, to be held in Shenzhen, China from August 26 to 28, 2026.

At our booth, we will present the E Series solder paste for power devices, developed for formic acid reflow. In addition to achieving ultra-low voiding, the E Series features zero flux residue. Unlike conventional solder pastes that leave residues requiring cleaning to avoid interference with molding or wire bonding, the E Series leaves no flux residue after soldering-eliminating the cleaning process and reducing overall costs.

E Series Product Page
Japanese
English

We warmly welcome you to visit the KOKI booth (Hall 16, Booth H07) at PCIM ASIA Shenzhen 2026.

PCIM ASIA Shenzhen 2026
August 26 – 28, 2026
Shenzhen, China
https://pcimasia-shenzhen.cn.messefrankfurt.com/shenzhen/en.html