Challenge
High Electrical Reliability
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What is high electrical reliability?
High electrical reliability solder paste can maintain good insulation resistance even in a narrow-pitch pad design.
Issue with reliability test of narrow-pitch pad design
Electrical reliability of the flux residue is tested on a comb-pattern test board and JIS and IPC calls for a conductor line widths and spacings to be 0.318mm. However, the number of customers who requires stricter flux residue reliability is increasing. As a result, number of insulation reliability test with much narrower comb-pattern design is increasing.
Problem
- Ionized metal is easier to move and increases the chance of migration occurrence.
- In a narrow-pitch pads, flux residue tends to cumulate between conductor lines.
Solution
“Resin which resists absorbing humidity in a dump condition” and “a combination of materials which prevents generating metallic ion” can ensure high insulation resistance in a narrow pitch design PCBs.
High reliability in narrow-pitch design through a new technology
Prevents migration occurrence by reducing the metallic ion by reducing the amount of activators.
Reduce metallic salt in flux residue
Less metallic salt in the flux reduces the impact of metallic salt on insulation resistance.
■Sn content in flux residue
Flux residue reliability (narrow-pitch reliability test PCB: 0.125mm)
Resistance was high throughout the test. No indication of migration occurrence after 1000 hours of bias voltage.
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