KOKI COMPANY LIMITED KOKI COMPANY LIMITED

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Product Development of KOKI

Empowering the Future with Innovative Technology

We are committed to the continuous development of products that meet the ever-evolving performance requirements, by pursuing the optimal combination of organic chemical actions (flux) and various solder alloys in soldering materials. In addition to our standard products, we actively respond to the changing trends and demands of the electronics industry. With our unwavering commitment to development and our high level of technical expertise, we are advancing product development in new fields.

Message - Driving Innovation with Soldering Expertise -

The Reserch and Technology Division at KOKI is a group of soldering joining technology experts, passionate about driving progress and innovation. Our mission is to provide our customers with valuable products and services. We continuously develop new products with innovative technologies and provide technical information to contribute to further advancements in assembly technologies. In response to issues arising on our customers' production lines, we apply our years of accumulated analysis expertise to investigate root causes and offer preventive solutions. Moving forward, we will continue to grow together with our customers and provide valuable technical insights.

Head of Reserch and Technology Division
Mr. Noriyoshi Uchida

Product Categories

Unlocking New Product Value Through Innovation

At KOKI, we are dedicated to creating products that inspire and delight every customer. To achieve this, we form cross-functional project teams that work collaboratively to not only meet but exceed customer expectations by delivering added value. Our entire team is united in developing high-value-added products and services that contribute to the advancement of the electronics industry.

As a trusted partner, we are committed to driving innovation in the production of electronic devices that support daily life.

Solder Paste

Solder paste, composed of solder powder and flux, is a paste-form soldering material. We respond to the increasing functionality and density of modern PCB assemblies by offering a high-performance and comprehensive range of products.

  • Powerful Wetting
  • Low Voiding
  • Low Flux Splattering
  • Halogen-free
  • For fine-pitch printing
  • Clack-free flux residue
  • High Reliability
  • High Temperature
  • Low Cost
  • Low Temperature
  • Dispense
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Flux for Wave Soldering

Flux is an essential material for soldering, designed to remove oxide layers from the surface and create a joinable state. We offer a range of optimal products tailored to customer's operating environment, materials, and specific requirements.

  • Powerful Wetting
  • Rosin-based
  • Low-solids
  • Halogen-free
  • Cleanable
  • Repair
  • Terminal processing
  • VOC-free
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Tack Flux

Tack flux is a paste-type flux used not only for component repair but also for PoP (Package on Package) assembly, a space-saving technique designed to meet the increasing demands for high-density circuit boards in mobile, tablet devices etc.

  • Repair
  • Transfer
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Flux Cored Solder Wire

Solder wire is a commonly used material in wire form. We offer a wide range of options in various alloys and diameters, suitable for hand, robotic, and laser soldering applications.

  • Powerful Wetting
  • High Reliability
  • Low Cost
  • Anti-iron tip Erossion
  • Halogen-free
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Heat Curable SMT Adhesive

This is a special type of insulating adhesive used in soldering. It offers stable dispensing performance and high adhesive strength, as well as compatibility with component self-alignment in dual-sided reflow processes. Additionally, it supports low-temperature curing and provides reinforcement for electronic components, making it suitable for a variety of applications.

  • Dispensing
  • Printing
  • Low Curing Temperature
  • For Reflow
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For Power Semiconductor Devices

Power Semiconductor Devices such as IGBT and power MOSFETs enable high-efficiency power conversion and are expanding their applications across various industries, including household and industrial inverters, railways, renewable energy generation, and electric vehicles (EVs). Due to the importance of thermal management in power devices, advanced soldering techniques are required to achieve ultra low voids. Leveraging our developed flux technologies, we propose new joining solutions for power devices, contributing to stable quality and reduced production costs.

  • Formic acid oxidation-reduction reflow
  • Ultra low void
  • Streamline production process
  • Various alloys
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Contact Us

For any requests for estimates, product information, technical questions, etc. please reach out to us.