We are delighted to announce to participate in the upcoming 39^th INTERNEPCON JAPAN in Tokyo!

Date: Jan. 22 (Wed) – 24 (Fri), 2025 10:00-17:00

Venue: Tokyo Big Sight, Japan
Booth location: East Hall 1 – E2-1

We will showcase high-quality, state-of-the-art soldering materials under the themes of “Soldering Materials Contributing to Carbon Neutrality,” “Environmental Sustainability,” and “Process Optimization.” Be sure to visit us to discover our unique new products designed to meet the ever-growing demands for advanced soldering technology, energy savings, and power efficiency.

Soldering Materials Contributing to Carbon Neutrality

・Halogen-free High Reliability Solder Paste based on SABI alloy

・High Performance Low Melting Point Solder Paste

Environmental Sustainability

・Multi-feature Halogen-free Solder Paste for General Applications

・Newly developed High Reliability alloy

Optimization

・The ‘Zero Flux Residue’ Solder Paste for Oxidation-Reduction Vacuum Reflow Process

・Pin-in-Paste method

If you’d like to schedule a meeting with us during the exhibition, please feel free to contact us.

We look forward to seeing you at East Hall 1, Booth E2-1!

39^th INTERNEPCON JAPAN, Jan. 22 (Wed) – 24 (Fri), 2025

Asia’s Leading Exhibition for Electronics R&D, Manufacturing and Packaging Technology https://www.nepconjapan.jp/tokyo/en-gb.html#/