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Come join us at NEPCON Shenzhen 2025!

2025.10.07

We are pleased to announce that KOKI will be exhibiting at “NEPCON Shenzhen 2025”, to be held at Shenzhen World Exhibition & Convention Center, China from October 28 to 30, 2025.

At our booth, we will showcase four newly developed solder paste series that address the industry’s demands for higher reliability, lower voiding, cost competitiveness, and advanced power device applications:

【Featured Products】

BIG Series – Cost-effective, high-reliability solder paste.

Exhibition Details

Date: October 28 (Tue) – 30 (Thu), 2025
Venue: Shenzhen World Exhibition & Convention Center, China
Booth: Hall 13 – 13G35

We look forward to meeting you at Hall 13, Booth 13G35 at NEPCON Shenzhen 2025!

Contact Us

For any requests for estimates, product information, technical questions, etc. please reach out to us.