We are pleased to announce that KOKI will be exhibiting at “NEPCON Shenzhen 2025”, to be held at Shenzhen World Exhibition & Convention Center, China from October 28 to 30, 2025.

At our booth, we will showcase four newly developed solder paste series that address the industry’s demands for higher reliability, lower voiding, cost competitiveness, and advanced power device applications:

【Featured Products】

・HF1200 Series [NEWLY LANUCHED] – Multifunctional halogen-free solder paste with ultra-low voiding.

・G850 Series [NEWLY LANUCHED] – High-reliability halogen-free Alloy solder paste with ultra-low voiding.

・BIG Series – Cost-effective, high-reliability solder paste.

・E Series – Power electronics solder paste with zero flux residue, eliminating the need for post-cleaning.

Exhibition Details

Date: October 28 (Tue) – 30 (Thu), 2025
Venue: Shenzhen World Exhibition & Convention Center, China
Booth: Hall 13 – 13G35

We look forward to meeting you at Hall 13, Booth 13G35 at NEPCON Shenzhen 2025!

https://www.nepconasia.com/en-gb.html