We are pleased to announce that KOKI will be exhibiting at “PCIM ASIA Shanghai 2025”, to be held in Shanghai, China from September 24 to 26, 2025.

At our booth, we will present the E Series solder paste for power devices, developed for formic acid reflow.
In addition to achieving ultra-low voiding, the E Series features zero flux residue.
Unlike conventional solder pastes that leave residues requiring cleaning to avoid interference with molding or wire bonding, the E Series leaves no flux residue after soldering-eliminating the cleaning process and reducing overall costs.

E Series Product Page
Japanese
English

Furthermore, during the exhibition, we will also present our E Series product at the official forum:

Forum Presentation
Date & Time: Wednesday, September 24, 15:20–15:40
Venue: Hall N4, Booth E50

We warmly welcome you to visit the KOKI booth (Hall N4, Booth D22) at PCIM ASIA Shanghai 2025.

PCIM ASIA Shanghai 2025
September 24 – 26, 2025
Shanghai, China
https://pcimasia-shanghai.cn.messefrankfurt.com/shanghai/en.html