Struggling with Voiding or Wettability?

With advancements in PCB and component quality and performance in SMT industry, the demands on solder materials have also increased.

In response to the industry’s growing need to address voiding and wettability challenges, we have newly developed a unique product featuring two groundbreaking technologies, the ‘2-Step Flux Gas Discharge Effect’ and ‘2-Step Activation Boost Effect’ delivering unprecedented level of assembly quality!

Realizing the lowest void performance ever achieved!

The 2-step Flux Gas Discharge Effect, significantly reduces voids at both stages, ensuring effective void discharge.

Step-1: Active Coagulation Effect
Step-2: Active Outflow Effect

QFN Voiding Behavior during reflow

・Material : Glass epoxy FR-4
・Surface treatment : OSP
・Stencil thickness : 0.12mm (laser cut)
・Component: QFN (Sn plating)

Low void regardless component design and surface finish

Owing to the 2-step Flux Gas Discharge Effect, low voids are achieved even in components, like bottom electrodes, where voids are typically difficult to eliminate.
It also ensures consistent performance, regardless of component size and surface finish.

■Voiding result of different components

Achieving unparalleled powerful wetting performance!

The 2-Step Activation Boost Effect delivers exceptional powerful wetting performance while remaining completely halogen-free, ensuring both high reliability and environmental compliance.

Step-1: Activation Stabilizer
Step-2: High Temperature Activation Boost

Powerful wetting delivers wide range of applications

The 2-step Activation Boost Effect significantly enhances the flexibility of reflow profile design, achieving high wettability even under stringent conditions such as high temperatures and extended preheating durations. This provides a broad process window suitable for a wide range of applications.

Enhanced Print Stability realizes Faster Cycle Times

“The newly designed flux formulation maintains viscosity during long continuous use, ensuring shape retention and stable paste print deposit contour, minimizing issues such as slumping, smearing, and bleeding, thus reducing stencil cleaning frequency and shortening cycle times.

■Continual Printing Feature