Thank you to all customers, prospects and partners who visited KOKI at PCIM Asia Shanghai 2025 (Sept 24-26, 2025) – we appreciated the opportunity to meet and discuss your needs at Hall N4, Booth D22.

At the show we highlighted the E Series solder paste for formic-acid reflow, which delivers ultra-low voiding and zero flux residue – eliminating post-solder cleaning and reducing process cost. We also presented at the PCIM Forum on Wednesday, Sept 24, 15:20 – 15:40 (Hall N4, Booth E50).

E Series Product Page
Japanese
English

We hope you enjoyed our booth and received the answers you were looking for.
Please do not hesitate to contact us if you have any inquiries or feedback that you would like to share.

See you at the next show!

PCIM ASIA Shanghai 2025
September 24 – 26, 2025
Shanghai, China
https://pcimasia-shanghai.cn.messefrankfurt.com/shanghai/en.html