Thank you to all customers, prospects and partners who visited KOKI at PCIM Asia Shenzhen 2026 (Aug 26-28, 2026) – we appreciated the opportunity to meet and discuss your needs at Hall 16, Booth H07.

At the show we highlighted the E Series solder paste for formic-acid reflow, which delivers ultra-low voiding and zero flux residue – eliminating post-solder cleaning and reducing process cost.

E Series Product Page
Japanese
English

We hope you enjoyed our booth and received the answers you were looking for.
Please do not hesitate to contact us if you have any inquiries or feedback that you would like to share.

See you at the next show!

PCIM ASIA Shenzhen 2026
August 26– 28, 2026
Shenzhen, China
PCIM Asia Shenzhen