Solder Paste
Essemtec-approved Solder Paste for Jet Dispensing
- E170DN-ESS series
E170DN-ESS series is designed for non-contact jet dispensing with sufficient clearance. This model is certified by Essemtec for compatibility with their jet dispensers, ensuring fast, stable, and consistent jetting performance even in high-speed & fine pattern production environments.
feature
- Essemtec-approved product
- High-speed non-contact dispensing shortens production time
- Effective for irregularly shaped components and 3D mounting; it also enables stencil-less soldering
- Available in various powder sizes (IPC Type 5–6) for versatile applications
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
E170DN-ESS series
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217-219
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Particle Size（μm）
S3X70-E170DN-ESS：10-25 / S3X811-E170DN-ESS：5-20
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Flux Content（%）
21.0
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Viscosity（Pa.s）
S3X70-E170DN-ESS：20 / S3X811-E170DN-ESS：23
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004D)
Solder paste approved by Essemtec
The E170DN-ESS series has been jointly developed with Essemtec, a leading Swiss industrial machine manufacturer, and is designed to deliver optimal performance on Essemtec’s jet dispensing equipment.
Excellent high-speed jet dispensing performance
With optimized solder powder size (IPC Type 5 and 6 compliant), viscosity, and controlled thixotropy, the E170DN-ESS series achieves high-precision dispensing and delivers stable performance and optimal solutions even under demanding operating conditions, without issues such as needle clogging, solder icicles, or splattering.
“Halogen-Free” – Addressing Environmental Requirements
One key aspect of environmental measures is “halogen-free”; today, many companies require final products to be halogen-free. The halogen-free E170DN-ESS series meets these requirements while providing both reliability and workability.
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