Solder Paste
High durability alloy solder paste
- SB6N58-M500SI
SB6N is a high-reliability alloy that reduces solder joint transformation through advanced alloy strengthening technologies. The addition of indium significantly enhances the thermomechanical durability of the solder joints. With excellent thermal fatigue properties, SB6N is ideal for harsh conditions, improving product life in automotive and industrial equipment. Additionally, its lower melting point compared to SAC305 allows for reduced reflow temperatures.
feature
- Effectively suppresses crack extension under thermal cycle conditions
- Significantly reduces voiding
- Enables to use the same reflow profile as SAC305
- Applicable for 0603 metric chips / 0.25 mm diameter for CSP mounting
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
SB6N58-M500SI
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Composition
Sn 3.5Ag 0.5Bi 6.0ln
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Melting Point（℃）
202 - 210
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.1 / 13.0(for Dispense)
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Viscosity（Pa.s）
200 / 120(for Dispense)
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
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Characteristics
for Dispense: SB6N58-M500SID
Increasing demand for high thermal stress durability
For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress.
Absorption of mechanical stress by addition of indium
SB6N58 M500S1 adopted 6% indium to balance and optimize thermal stress and deformation character̶ istics, which could occur if excessively added.
Remarkable joint reliability
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