Solder Paste
Water-soluble Halogen-free Solder Paste
- S3X58-HF950W
S3X58-HF950W is designed to inhibit the formation of metal salts that interfere with water wash cleaning. Conventional products faced challenges in achieving both water-cleanability and workability. However, with the introduction of a new active ingredient that works effectively in minimal amounts, we have successfully realized both capabilities.
feature
- Flux residue can be cleaned using deionized (DI) water or a water-based cleaning agent
- Minimal property changes during the continuous printing process ensure stable soldering performance
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S3X58-HF950W
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
20 - 38
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Flux Content（%）
11.4
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Viscosity（Pa.s）
180
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Halide content（%）
0
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Flux Type
ORH0 (IPC J-STD-004C)
Benefit of Using DI Water and Water Based Cleaner
Recent environmental regulations have changed the way manufacturers choose the cleaning agent and equipment. Many countries require a facility which complies with their wastewater management regulations in order to use non-water based or semi-water based cleaning agents.
Although water based cleaning agent requires an initial cost when introducing the designated equipment, it has its own benefits.
– Flash point is low so that it is safe
– No need to store in designated storage
– Cheaper running cost
– Less wastewater which is eco-friendly
Solving Concerns during Storage
Conventional water-soluble flux is comprised from a limited selection of water-soluble materials. This restriction has caused water-soluble flux to have low flux shape retention. As a result, constituents would separate and may cause solder paste print errors in continuous printing.
S3X58-HF950W water-soluble solder paste uses a gelling agent with stronger linkage to prevent the constituents from being separated.
S3X58-HF950W has improved stability during storage and on the stencil to achieve comparable processibility as conventional rosin-based solder pastes.
A New Approach to Remove Hard-to-Clean Substances
Solder paste contains various activators to help the solder to melt. However, these activators could form metallic salt which inhibits PCB cleaning after reflow.
S3X58-HF950W adopted new activators which can remove oxide layer sufficiently and has reduced metallic salt generation to help solder melting without losing flux residue cleanability.
In addition, the flux residue is designed to include metallic salt in the water-soluble material so they can be cleaned together.
High Cleanability
The new flux design solves concerns associated with conventional water-soluble solder paste and allows the flux residue to be cleaned by water.
PCB Cleaning Examples
S3X58-HF950W achieved both good cleanability and processibility despite being a halogen-free solder paste. It can be applied on a variety of PCBs as it ensures high surface mount quality.
– Semiconductors, electronic components
– Automotive products, industrial machines
– Medical and defense products
– PCBs to be used with underfill or coating material
Keywords / Related Products
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