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ICT testable Halogen-Free Solder Paste

  • S3X58-HF960
ICT testable Halogen-Free Solder Paste

S3X58-HF960 significantly reduces false failures during in-circuit testing (ICT) by preventing flux residue from adhering to test probes, as the newly developed “flux fluidity technology” allows the residue to flow away from the solder surface. In addition, its wetting performance is comparable to that of halogen-containing solder paste and helps minimize void formation regardless of component type.

feature

  • Significantly improved ICT performance through unique flux flow technology
  • Powerful wetting performance comparable to halogen-containing solder paste
  • Achieves low voiding regardless of component design, including bottom-terminated components (e.g., power transistors and QFN/BTC, etc.)
  • Halogen-free, with no artificial addition of halogen elements

Product Performance Table

  • Product name

    S3X58-HF960

  • Composition

    Sn 3.0Ag 0.5Cu

  • Melting Point(℃)

    217-219

  • Particle Size(μm)

    20-38

  • Flux Content(%)

    11.6

  • Viscosity(Pa.s)

    190

  • Halide content(%)

    0

  • Flux Type

    ROL0 (IPC J-STD-004D)

Unique “Flux Fluidity Technology” to improve ICT performance

Utilizing proprietary flux fluidity technology, the flux system in the S3X58-HF960 improves flux residue flow behavior, ensuring that almost no flux residue remains on the solder fillet surface after reflow.

Ensuring reliable test probe contact!

Improved flux fluidity prevents flux residue from remaining on the solder fillet and ensures reliable pin-to-solder contact performance.
In addition, reduced flux residue on test probes decreases probe maintenance frequency (cleaning/replacement) and associated costs.

Drastically improves in-circuit test consistency

Conventional solder pastes cause flux residue to build up on test probe tips during continuous testing, increasing contact resistance.
The S3X58-HF960 is designed to reduce flux adhesion, ensuring that resistance measurements remain stable throughout testing.

■ICT Characteristics

Low void regardless component design and surface finish

■Voiding results for various components

Ensures up to 1 hour of intermittent printability for enhanced processibility

Eliminates printing issues after extended idle time, allowing stable printing to resume even after 60 minutes of downtime.

■Intermittent printability test results

“Halogen-Free” – Addressing Environmental Requirements

One key aspect of environmental measures is “halogen-free”; today, many companies require final products to be halogen-free.
The halogen-free S3X58-HF960 meets these requirements while providing both reliability and workability.

Contact Us

For any requests for estimates, product information, technical questions, etc. please reach out to us.